EPP Small Experiments Document 120-v2

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x-rays of of VTT-bumped BTeV hybrids (FPIX2.1)

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David Christian
Updated by:
David Christian
Document Created:
03 May 2006, 15:03
Contents Revised:
09 May 2006, 15:47
Metadata Revised:
08 Jun 2006, 10:23
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03 May 2006, 15:05
On 4/21/06 I inspected "Gelpak 0" using the x-ray machine on FCC-3. Two of the single-chip hybrids had been removed (one of these has been electrically tested & has no bad bumps).
I found only one missing solder bump in 35x22x128=98,560 bumps inspected with the x-ray machine.
I see one unexplained dark spot & something that looks like a stain on one x-ray (each of these on one of the 8-chip hybrids).

On 5/9/06, I inspected "Gelpak 2."
I found no missing bump in 40x22x128=112,640 positions.
I found one group of 4 bumps in which at least two bumps are probably merged (on sensor B10-2-08-5R-3, chip 2).
I found one other bump which may be merged with a neighbor (same sensor, chip 1).

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Related Documents:
  • EPP-doc-75: First shipment of hybrids from VTT - Feb. 2006
  • EPP-doc-111: 2nd shipment of hybrid pixel sensors from VTT - April, 2006
Referenced by:
  • EPP-doc-147: Third (& final) shipment from VTT of prototype BTeV TESLA FPIX2.1 hybrids
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