EPP Small Experiments Document 86-v1

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Micro contacts with Sub-30 um pitch for 3D Chip on Chip Integration

Document #:
EPP-doc-86-v1
Document type:
Talk
Submitted by:
Raymond Yarema
Updated by:
Raymond Yarema
Document Created:
13 Mar 2006, 14:26
Contents Revised:
13 Mar 2006, 14:26
Metadata Revised:
13 Mar 2006, 14:26
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Abstract:
Describes the process for SOlid Liquid InterDiffusion process SOLID
Files in Document:
Keywords:
3D
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