EPP Small Experiments Document 845-v1

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Sensor/IC Integration Using Oxide Bonding

Document #:
EPP-doc-845-v1
Document type:
Talk
Submitted by:
David Christian
Updated by:
David Christian
Document Created:
03 Nov 2009, 16:30
Contents Revised:
03 Nov 2009, 16:30
Metadata Revised:
03 Nov 2009, 16:30
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Abstract:
By Zhenyu Ye - presented at IEEE NSS/MIC 2009
Oct 25-31, 2009
Orlando, FL
Files in Document:
  • pdf (ZYTalk_N22-3.pdf, 1.3 MB)
Authors:
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