EPP Small Experiments Document 1644-v8

DocDB Home ]  [ Search ] [ Last 20 Days ] [ List Authors ] [ List Topics ] [ List Events ]

IFCP65 Test Board(s)

Document #:
EPP-doc-1644-v8
Document type:
Talk
Submitted by:
David Christian
Updated by:
David Christian
Document Created:
08 Aug 2016, 12:48
Contents Revised:
23 Feb 2017, 09:08
Metadata Revised:
24 Feb 2017, 07:34
Viewable by:
  • Public document
Modifiable by:

Quick Links:
Latest Version

Other Versions:
EPP-doc-1644-v7
10 Nov 2016, 10:49
Abstract:
NOTE: The small ICs (level adapters) should be mounted on the IFCP65 daughter cards before the chip is mounted & bonded. This makes it much easier to solder the small ICs & properly clean the board.

Schematics, parts lists, some photos/layout prints,
Presentation dtd 8/1/16.
IFCP65 pads are 70 microns center to center.

Files in Document:
Other Files:
Related Documents:
DocDB Home ]  [ Search ] [ Last 20 Days ] [ List Authors ] [ List Topics ] [ List Events ]

DocDB Version 8.8.9, contact EPP Document Database Administrators