EPP Small Experiments Document 1569-v2

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Check of bump bond pattern

Document #:
EPP-doc-1569-v2
Document type:
Memo
Submitted by:
David Christian
Updated by:
David Christian
Document Created:
23 Jul 2014, 17:25
Contents Revised:
29 Dec 2017, 11:51
Metadata Revised:
29 Dec 2017, 11:51
Viewable by:
  • Public document
Modifiable by:

Quick Links:
Latest Version

Other Versions:
EPP-doc-1569-v1
29 Mar 2016, 10:51
Abstract:
Screen shots from GDS viewer of bump bond pads on FCP130 (bottom left corner rotated 90 degrees clockwise to become top left) and Sensor (file sent by Gino long ago) top right corner. Bump patterns will match after FCP130 is flipped over.
Files in Document:
  • pdf (Flipchipassy.pdf, 497.1 kB)
  • ppt (Flipchipassy.pptx, 613.8 kB)
Other Files:
Notes and Changes:
I swapped the "sensor" and "FCP130" labels on the ppt & pdf of the corner (6/7/17, dcc).
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